Human Body Model

When talking about ESD Classifications a little while ago, we identified a “class 0” item as withstanding discharges of less than 250 volts.

The introduction of ANSI/ESD S20.20 states: “This standard covers the requirements necessary to design, establish, implement and maintain an Electrostatic Discharge (ESD) Control Program for activities that manufacture, process, assemble, install, package, label, service, test, inspect or otherwise handle electrical or electronic parts, assemblies and equipment susceptible to damage by electrostatic discharges greater than or equal to 100 volts Human Body Model (HBM) and 200 volts Charged Device Model (CDM).

So how do you handle items that are susceptible to voltages of less than 100V? That’s what we’re going to answer in today’s blog post.

 

Introduction

Years ago, it was common for devices to be vulnerable to voltages greater than 100 V. As the need for smaller and faster devices increased, so did their sensitivity to ElectroStatic Discharges as circuit-protection schemes were removed to stay ahead of the market. These new extremely sensitive components are now susceptible to discharges nearing 0 V. This causes problems for companies handling these devices: while their ESD program may be in compliance with the ESD Standard, extremely sensitive devices require tighter ESD Control to protect them from ESD failures.

 

What is a “Class 0” device?

Before moving any further, we need to qualify the term “class 0”. As stated above, the HBM Model refers to any item with a failure voltage of less than 250 V as a “class 0” component. However, in recent times, the term has been used more and more to describe ultra-sensitive devices with failure voltages of less than 100 V. Whilst the following tips and tricks work on any “class 0” item, they are specifically designed to protect extremely sensitive items that withstand discharges of less than 100 V.

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Ultra-sensitive devices are extremely common

Before Updating Your ESD Program

“Class 0” refers to a wide range of items and there are a few things you should remember before making any changes to your existing ESD program:

  1. Verify what ESD Model your company/engineers/customers etc. are referring to. As we have learnt in the past, there are different ESD models (HBM, CDM, MM) as well as individual classifications for each model. A lot of people get confused when it comes to citing ESD classifications. There is only one “class 0” which refers to the human body model (HBM) but it’s always best to check.
  2. Check the specific withstand voltage an individual part is susceptible to. “Class 0” refers to all items that withstand discharges of less than 250 V. However, there is a big difference between a failure voltage of 240 V or 50 V. You need to have detailed ESD sensitivity information available before being able to make decisions on how to improve your existing ESD control program. This step is part of creating a compliance verification plan.
  3. A part’s ESD classification is only of importance until it is ‘merged’ into an assembly. So, the ESD classification of a device only refers to the stand-alone component. Once it goes into another construction, the classification of the whole assembly is likely to change.

 

Tips for handling “Class 0” Items

Below are 6 tips that will help your company to upgrade your ESD control program so you can effectively and efficiently handle ultra-sensitive items without risking ESD damage.

One thing to note: The best approach to stay ahead of the game is taking proactive actions. It is critical to figure out how to protect your components from ESD damage before you receive them. If actions are taken after components are received, the components are susceptible to receiving ESD damage.

 

1. Improve Grounding

Inside an EPA, all conductors (including people) are grounded. Now you’re probably thinking: “But I’ve already grounded my operators and worksurfaces. What else is there left to do?”. Firstly, well done for properly grounding the ‘objects’ in your EPA. The next step is to adjust and improve your current program to allow for even better protection. Here are some suggestions:

Personnel:

  • Decrease the wrist strap and ESD footwear upper limit. The ESD Association has test data showing charge on a person is less as the path-to-ground resistance is less.
  • Use continuous monitors and ESD smocks
  • Introduce/increase the use of ESD flooring
  • Use sole or full coverage foot grounders (rather than heel grounders)
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Full coverage foot grounders are recommended when handling ultra-sensitive devices

Worksurfaces:

  • Reduce the required limit for Point-to-Point resistance of 1 x 109 per the ESD Standard to 106 to 108 ohms (see #5). The reason for this reduction is simple: 1 x 109 is too high as it still produces thousands of volts of in electrostatic charges. However, the resistance cannot be too small either as this can lead to a sudden ‘hard discharge’ potentially damaging ESD sensitive components.

Other:

  • Improve grounding of carts, shelves and equipment to Ground
  • Minimize isolated conductors like devices on PCBs

 

2. Minimize Charge Generation

The best form of control is to minimize charge generation. First, you should always use shielding packing products like bags or containers (especially when outside an EPA) as these protect from generating charges in the first place. For more information on choosing the correct type of ESD Packaging, we recommend reading this post.

The next step is to eliminate charges once they are generated – this can be achieved through grounding and ionization. We’ll cover ionization in #3 and #4. We’ve already talked about improved grounding in #1. However, for ultra-sensitive components, we also recommend the following:

  • Personnel: Use low-charging floor finish
  • Surfaces: Use low-charging topical antistatic treatments

Both types of ESD products create a low tribocharging coating which allows charges to drain off when grounded. The antistatic properties will reduce triboelectric voltage to under 200 volts.

 

3. Remove Insulators

When talking about conductors and insulators, we explained that insulators cannot be grounded and can damage nearby sensitive devices with a sudden uncontrolled discharge. It is therefore critical to eliminate ALL insulators that are not required in your EPA: plastic cups, non-ESD brushes, tapes etc. How? Here are a couple of options:

  • Replace regular production supplies and fixtures with dissipative, low charging versions, e.g. ESD dissipative brushes, ESD dispensers, ESD tape, ESD Chairs etc.
  • Shield charges on clothing by using ESD smocks.
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Use ESD safe accessories whenever possible

If an insulator is absolutely necessary for production and cannot be removed from the EPA, you could consider a topical treatment which will reduce triboelectric charges.

Is this not an option, then move on to tip #4.

 

4. Use Ionization

First, ionization is not a cure-all. We’ve learnt that ionizers neutralize charges on an insulator.

However, that does not mean that you can just have any insulator in your EPA because the ionizer will “just fix it”. No, in this instance, prevention is generally a better option than the cure. So, your priority should ALWAYS be to remove non-process essential insulators from your EPA – see tip #3. If this is not possible – then ionization becomes essential.

Ionization:

  • Ionizers can be critical to reduce induction charging caused by process necessary insulators
  • Ionizers can be critical in eliminating charges on isolated conductors like devices on PCBs
  • Offset voltage (balance) and discharge times are critical considerations depending on the actual application
  • Ionization can reduce ElectroStatic Attraction (ESA) and charged particles clinging and contaminating products.

It is recommended to use ionizers with feedback mechanisms, so you’re notified if the offset voltage is out of balance.

 

5. Increase ESD Training and Awareness

ESD Training is a requirement of every ESD Program. When handling ultra-sensitive devices, it is even more important to remind everyone what pre-cautions are necessary to avoid damage. Regular ‘refreshers’ are a must and it is recommended to verify the effectiveness of the training program, e.g. through tests. So, who, when and what should be taught?

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ESD Training is a vital part of every successful ESD Control Program
  • ESD training needs to be provided to everyone who handles ESD sensitive devices – that includes managers, supervisors, subcontractors, visitors, cleaners and even temporary personnel.
  • Training must be given at the beginning of employment (BEFORE getting anywhere near a sensitive products) and in regular intervals thereafter.
  • Training should be conducted on proper compliance verification procedures and on the proper use of equipment used for verification.

 

6. Create an enhanced Compliance Verification Plan

We talked in a previous post about compliance verification, what it is and how to create a plan that complies with the ESD standard. So, if you already followed our steps and have a plan in place, here are a few tips to improve your compliance verification plan:

  • Use a computer data collection system for wrist straps and foot grounders testing
  • Increase the test frequency of personnel grounding devices from once per day to every time the operator enters the EPA
  • Use continuous monitors where operators are grounded via wrist straps. Consider computer based monitor data collection system, e.g. SMP. This should include continuous monitoring of the mat Ground.
  • Use Ground continuous monitors, e.g. Ground Master. At a large facility, the most frequent reoccurring violation is the ESD mat ground cord either becoming disconnected from the mat or grounding point. As Ground continuous monitors will only test the fact that the mat is grounded, it is still imperative that the Resistance to Ground of the mat is regularly tested. Remember that the use of improper mat cleaners can raise the mat surface resistance above the upper recommended level of <109
  • Test ionizers more frequently or consider self-monitoring ionizers. Computer based data collection systems are a good alternative, too.
  • Increase the use of a static field meter and nano coulomb testing to verify that automated processes (like auto insertion, tape and reel, etc.) are not generating charges above acceptable limits.

 

Conclusion

“Class 0” items require additional measures of ESD protection due to their sensitivity to ESD damage. The best way to protect these ultra-sensitive components is to increase ESD protective redundancies and periodic verifications to all ESD Control technical elements.

To decrease the probability of ESD damage while handling ultra-sensitive items, additional precautions are required. This includes additional and/or more stringent technical requirements for ESD control products, increasing redundancies, and more frequent periodic verifications or audits.

Additionally, ESD control process systems should be evaluated as to their performance as a system. It is important to understand how the technical elements in use perform relative to the sensitivity of the devices being handled. Thus, tailoring the process to handle the more sensitive parts. For example: If the footwear/flooring allows a person’s body voltage to reach 80 volts and a 50 withstand voltage item gets introduced into the process, you must either allow only handling via wrist straps or would have to find a way to modify the footwear/flooring performance to get peak voltages below the 50 volt threshold.

Remember: The ESD Standard gives recommendations that will always be behind current/future developments. As soon as a Standard is published, technology will have progressed. In order to protect your devices and company reputation for reliable devices – it is recommended your company take responsibility to implement methods/procedures that exceed the recommendations of the ESD Standard to fit your sensitive component requirements.

 

References:

As reviewed previously, an Electrostatic Discharge is a rapid, spontaneous transfer of an electrostatic charge induced by a high electrostatic field through a spark between two bodies at different electrostatic potentials as they approach or are separated from one another.

The ESD Association characterizes three models of discharge, Human Body Model (HBM), Charged Device Model (CDM) and Machine Model (MM). Each model is intended to follow specific discharge properties such as the rise and fall times of the discharge current waveform.

Today, we will discuss HBM and CDM.

Human Body Model (HBM) simulates a person becoming charged and discharging from a bare finger to ground through the circuit under test. Humans are considered a primary source of ESD and HBM can be used to describe an ESD event due to the combination of the capacitance of a human body and resistance of skin touching a sensitive component. Typically, you need to pay better attention to personnel grounding to eliminate HBM.

Per ESD Handbook ESD TR20.20-2016 section 3.4.1 Human Body Model (HBM)

HBM has been in use for over 100 years. It was first defined to allow measurement and evaluation of explosion hazards for underground mining operations. There are a few different test standards describing the HBM for military and commercial applications, but the differences are in the application of the test, calibration of the system, and other ancillary items. The waveform, as defined by the human body resistance and capacitance, is virtually identical among all the test standards. The most widely used standard is ANSI/ESDA/JEDEC JS-001. The HBM test standard uses a stressing circuit which charges a 100 pF capacitor to a known voltage and discharges through a 1500-ohm resistor as shown in Figure 3. The simulators are verified by measuring various features of the current waveform, some of which are shown in Figure 4. Full details for tester qualification and waveform verification are described in ANSI/ESDA/JEDEC JS-001.

Charged Device Model (CDM) simulates an integrated circuit becoming charged and discharging to a grounded metal surface. CDM can be used to describe an ESD event due to an integrated circuit that is suspended on a vacuum pick and then placed on a metal surface during assembly.

Manual operation and handling is much less likely these days as operations have become more automated. CDM is the most pragmatic discharge model in automated production today. Anytime a sensitive device is lifted from a tray and transported it is most likely generating a charge.

Per ESD Handbook ESD TR20.20-2016 section 3.4.2 Charged Device Model (CDM)

In principle, there are two variations of CDM. The first considers the situation of a device that is charged (through tribocharging) on its package, lead frame, or other conductive paths followed by a rapid discharge to ground through one pin or connector. The second considers the situation of a device which is placed in an electric field due to the presence of a charged object near the device. The device’s electrostatic potential is increased by this field. This process is sometimes referred to as static induction. The device will discharge if it is grounded while still in the electric field. In both cases, the device will discharge, the failure mode will be the same, and the failure type and location will be the same. The most widely used CDM standards use the static induction approach. In CDM simulators, the device is grounded by a pogo pin contacting one pin or lead of the device. The current through the pogo pin can be measured and recorded which is particularly important as the discharge current determines the ESD threshold, a schematic of this is shown in Figure 5.

Experimental results show that the CDM discharge current is very fast, with rise-times measured often below 100 ps with a “pulse width” (full width half-maximum [FWHM]) of less than 500 ps to1 ns, an example waveform with the key parameters is shown in Figure 6. By comparison, the HBM discharge has a typical rise-time of 2 to 10 ns and durations of hundreds of ns. Until 2014, the most commonly used CDM standards were JEDEC JESD22-C101 or ANSI/ESD STM5.3.1. These have now been superseded by ANSI/ESDA/JEDEC JS-002.

So, why does it matter?
Different types of discharge can affect devices in different ways. HBM is a somewhat slow discharge and ranges from 10 to 30 nanoseconds. CDM is a very fast discharge which in turn means the energy has no time to dissipate. The CDM-type damage threshold is often 10 to 20 times lower than the one for an HBM-type discharge. If an HBM-type discharge causes damage at 2000V, it is not uncommon to have the same component damaged by a 100 to 150V CDM event.

Per ESD Handbook ESD TR20.20-2016 section 3.2.1     Threats in Electronic Production Lines
ESD threats in electronics manufacturing can be classified into three major categories:

  • Charged personnel – When one walks across a floor a static charge accumulates on the body. Simple contact of a finger to a device lead of a sensitive device or assembly which is on a different potential, e.g., grounded, allows the rapid transfer of charge to the device.
  • Charged (floating) conductor – If conductive elements of production equipment are not reliably connected to ground, these elements may be charged due to triboelectric charging or induction. Then these conductive elements may transfer charge to a device or assembly which is at a different potential.
  • Charged device/boards – During handling, devices or boards can acquire a static charge through triboelectric charging or can acquire an elevated electrostatic potential in the field of nearby charged objects. In these conditions, contact with ground or another conducting object at a different electrostatic potential will produce a very fast ESD transient.

This categorization is useful in that each category implies a set of ESD controls to be applied in the workplace. ESD threats from personnel are minimized by grounding personnel through the use of wrist straps and/or footwear/flooring systems. Discharges from conductive objects are avoided by assuring that all conductive parts that might contact devices are adequately and reliably grounded. The occurrence of ESD involving charged devices or boards is minimized by a) preventing charge generation (low-charging materials, ionization) or b) by providing low-current “soft landings” using dissipative materials.

Since these preventive measures are seldom perfectly deployed, the overall threat of ESD failure remains and the risk ultimately depends on how well the controls are maintained and the relative sensitivities of the devices being handled.

Taking Action
SCS recommends reviewing your manufacturing process and determining what model is the most relevant for your facility. Are your components handled directly by hand or by a hand tool such as tweezers or a vacuum pick?

Finding the root cause of ESD events is crucial to solving the problem. SCS technology can identify events in areas like SMT line, soldering, printer and repair stations. SCS has instrumentation to identify component sensitivity and measure ESD events as well as ensure compliance within your facility.

The SCS CTM082 ESD Pro Event Indicator has a special CDM filter switch to filter and reject EMI signals that are not caused by CDM discharges. Make sure to set requirements for static voltage and discharge strength within your production environment based on the most sensitive component in production.

The SCS CTM048-21 EM Eye ESD Event Meter will calculate the event magnitude for HBM and CDM. It also logs the events to a microSD card so they can be downloaded to a PC. Solving ESD problems requires data; a before-and-after analysis of data may now be measured and used to tailor your ESD control program.

The SCS 770063 EM Aware Monitor is ideal for automated equipment and will provide an approximate voltage for the ESD event based on HBM and CDM models. The EM Aware Monitor has Ethernet network connectivity and communicates with our Static Management Program (SMP). All activity is stored into a database for on-going quality control purposes. SMP allows you to pinpoint areas of concern and prevent ESD events. Quantifiable data allows you to see trends, become more proactive and prove the efficiency of your ESD process control system.